Windows Server* 2003 support is ending; upgrade to Intel® Xeon® processor E5 v3 family-based servers and Windows Server 2012 R2 for more performance.
Windows Server* 2003 support is ending soon. This guide can help you understand why upgrading to both Intel® Xeon® processor E5 v3 family-based servers and Windows Server 2012 R2 improves data center performance.
The server based on Intel® Xeon® processor E7 family delivers mission-critical management and security capabilities.
Learn more about the Intel® Xeon® processor E7 v2 family through features and benefits such as workload scalability, performance, I/O bandwidth, and uptime and availability, as well as performance benchmarks and technical documents.
Intel® Itanium® processors deliver robust performance and support today's most demanding business applications.
Intel® Itanium® processor-based servers deliver robust performance and support today's most demanding business applications.
Build data center infrastructure on the Intel® Xeon® processor E5 v3 family with this real-world guide.
This real-world guide describes how the technology innovations in the Intel® Xeon® processor E5 v3 family can help you optimize your data center infrastructure and deliver new services such as cloud computing and big data.
White paper discusses integrated network acceleration benefits of Intel® I/O Acceleration Technology and Microsoft Windows Server 2008*.
Discusses the integrated network acceleration features, I/O challenges, technologies used, and benefits of Intel® and Microsoft Windows Server2008*.
Modified Intel® Xeon® processor E5 architecture and integrated 10GBASE-T solutions improve I/O for managing network growth and demanding applications.
Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.
Chapter 4 Performance Characteristics of IC Packages: Package characteristics and data for electrical, mechanical, and thermal IC package characteristics.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Discusses surface mount assembly processes, preconditioning flows and moisture absorption, thermal stress, and typical chemical environments. Also covers standardized moisture sensitivity levels and handling, packing, and shipping requirements.