Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.
Chapter 4 Performance Characteristics of IC Packages: Package characteristics and data for electrical, mechanical, and thermal IC package characteristics.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Discusses surface mount assembly processes, preconditioning flows and moisture absorption, thermal stress, and typical chemical environments. Also covers standardized moisture sensitivity levels and handling, packing, and shipping requirements.
In IT@Intel’s design center, the Intel® Xeon® processor E5 family test team deploys rigorous tests for performance and efficiency measurements.
In IT@Intel’s design center, the Intel® Xeon® processor E5 family test team deploys rigorous tests for performance and efficiency measurements.Tam Görünüm >
Product Brief: Intel® Xeon® processor 3000 sequence-based platforms, with 800 MHz DDR2 memory, is faster than previous-generation chipset.
Take your business to new levels with server platforms based on the Intel® Xeon® processor 3000 sequence and the Intel® 3200 chipsets.