Demonstration of concept to bring the endcap to life using Intel embedded technology.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.