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Intel® Xeon® Processor E5440

Intel® Core™2 Quad Processor Q9500

Essentials


Product Collection
Vertical Segment
Processor Number
Lithography
Use Conditions
New Design Availability Expiration Date


Product Collection	Legacy Intel® Xeon® Processors	Legacy Intel® Core™ Processors
Vertical Segment	Server	Desktop
Processor Number	E5440	Q9500
Lithography	45 nm	45 nm
Use Conditions	Server/Enterprise
New Design Availability Expiration Date	Monday, November 12, 2012	Wednesday, October 26, 2022


Product Collection	Legacy Intel® Xeon® Processors Legacy Intel® Core™ Processors
Vertical Segment	Server Desktop
Processor Number	E5440 Q9500
Lithography	45 nm 45 nm
Use Conditions	Server/Enterprise
New Design Availability Expiration Date	Monday, November 12, 2012 Wednesday, October 26, 2022

Performance Specifications


Total Cores
Processor Base Frequency
Cache
Bus Speed
FSB Parity
TDP
VID Voltage Range


Total Cores	4	4
Processor Base Frequency	2.83 GHz	2.83 GHz
Cache	12 MB L2 Cache	6 MB L2 Cache
Bus Speed	1333 MHz	1333 MHz
FSB Parity	Yes
TDP	80 W	95 W
VID Voltage Range	0.850V-1.3500V	0.8500V-1.3625V


Total Cores	4 4
Processor Base Frequency	2.83 GHz 2.83 GHz
Cache	12 MB L2 Cache 6 MB L2 Cache
Bus Speed	1333 MHz 1333 MHz
FSB Parity	Yes
TDP	80 W 95 W
VID Voltage Range	0.850V-1.3500V 0.8500V-1.3625V

Supplemental Information


Marketing Status
Launch Date
Servicing Status
Embedded Options Available
Datasheet


Marketing Status	Discontinued	Discontinued
Launch Date	Q1'08
Servicing Status	End of Servicing Lifetime	End of Servicing Lifetime
Embedded Options Available	Yes	No
Datasheet	View now


Marketing Status	Discontinued Discontinued
Launch Date	Q1'08
Servicing Status	End of Servicing Lifetime End of Servicing Lifetime
Embedded Options Available	Yes No
Datasheet	View now

Package Specifications


Sockets Supported
T_CASE
Package Size
Processing Die Size
# of Processing Die Transistors


Sockets Supported	LGA771	FCLGA775,LGA775
T_CASE	67°C	71.4°C
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Processing Die Size	214 mm²	164 mm²
# of Processing Die Transistors	820 million	456 million


Sockets Supported	LGA771 FCLGA775,LGA775
T_CASE	67°C 71.4°C
Package Size	37.5mm x 37.5mm 37.5mm x 37.5mm
Processing Die Size	214 mm² 164 mm²
# of Processing Die Transistors	820 million 456 million

Advanced Technologies


Intel® Turbo Boost Technology ^‡
Intel® Hyper-Threading Technology ^‡
Intel® Virtualization Technology (VT-x) ^‡
Intel® VT-x with Extended Page Tables (EPT) ^‡
Intel® 64 ^‡
Instruction Set
Idle States
Enhanced Intel SpeedStep® Technology
Intel® Demand Based Switching
Thermal Monitoring Technologies


Intel® Turbo Boost Technology ^‡	No	No
Intel® Hyper-Threading Technology ^‡	No	No
Intel® Virtualization Technology (VT-x) ^‡	Yes	Yes
Intel® VT-x with Extended Page Tables (EPT) ^‡	No
Intel® 64 ^‡	Yes	Yes
Instruction Set	64-bit	64-bit
Idle States	Yes	Yes
Enhanced Intel SpeedStep® Technology	Yes	Yes
Intel® Demand Based Switching	Yes	No
Thermal Monitoring Technologies	Yes	Yes


Intel® Turbo Boost Technology ^‡	No No
Intel® Hyper-Threading Technology ^‡	No No
Intel® Virtualization Technology (VT-x) ^‡	Yes Yes
Intel® VT-x with Extended Page Tables (EPT) ^‡	No
Intel® 64 ^‡	Yes Yes
Instruction Set	64-bit 64-bit
Idle States	Yes Yes
Enhanced Intel SpeedStep® Technology	Yes Yes
Intel® Demand Based Switching	Yes No
Thermal Monitoring Technologies	Yes Yes

Security & Reliability


Intel® Trusted Execution Technology ^‡
Execute Disable Bit ^‡


Intel® Trusted Execution Technology ^‡	No	No
Execute Disable Bit ^‡	Yes	Yes


Intel® Trusted Execution Technology ^‡	No No
Execute Disable Bit ^‡	Yes Yes

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