Intel® eASIC™ N5X Devices

Today’s emerging innovations in 5G wireless, Cloud and storage, AI, and edge applications require a broad range of new equipment, and one size no longer fits all. Intel® eASIC™ N5X devices offer an innovative solution to custom logic that provides up to 50% lower core power1 with lower unit-cost2 compared to FPGAs while providing faster time to market and lower non-recurring engineering costs when compared to cell based ASICs.3 4

Only Intel enables the complete custom logic continuum of FPGAs, structured ASICs, and ASICs to build equipment tailored to unique challenges of time to market (TTM), cost, power, volume, performance, and flexibility requirements.

Intel® eASIC™ N5X Devices

Intel® eASIC™ N5X Device Overview Tables

 

N5X007

N5X015

N5X024

N5X047

N5X088

eCells (M) / Logic Elements (M)

0.70

1.47

2.38

4.65

8.83

Equivalent ASIC gates (M)

7

15

24

47

88

M10K Memory

1752

3,684

6,004

11,780

22,372

M10K Memory (Mbits)

17.94

37.72

61.48

120.63

229.09

128b register file

12,488

26,180

42,560

82,992

157,640

128b register file (Mbits)

1.6

3.35

5.45

10.62

20.18

Secure device manager

Secure data manager AES-256/SHA-256 bitstream encryption/authentication, ECDSA 256/384 boot code authentication, anti-tamper protection, 3 independent user root keys.

Vendor authenticated boot (VAB), Secured data object storage (SDOS), Time and priority based key revocation.

Hard Processor System

Quad-core 64-bit Arm Cortex-A53 up to 1.5GHz, with 32 KB Instruction/Data cache, NEON coprocessor, 1 MB L2 cache, direct memory access (Direct Memory Access), system memory management unit, cache coherency unit, hard memory controllers for DDR4/LPDDR4/LPDDR4x, USB 2.0x2, 1G eMac* x3, UART x2, SPI (Serial Peripheral Interface) x4, I2C x5, general purpose timers x7, watchdog timer x4.

SoC IO EMIF* / Pin Mux / Dedicated

140 / 48 / 24

140 / 48 / 24

140 / 48 / 24

140 / 48 / 24

140 / 48 / 24

Max GPIO

416

560

682

682

1114

XCVR 32

16

24

32

64

80
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Intel® eASIC™ N5X Example Package Options

Packages can be customized per application requirements to replace an FPGA or reduce PCB footprint for a given application.

 Body size
(mm x mm)

Package Name

N5X007

N5X015

N5X024

N5X047

N5X088

27x27

FC676, FC1085

Yes

        

29x29

FC780, FC1221

Yes

Yes

      

31x31

FC896

Yes

Yes

Yes

    

35x35

FC1152

Yes

Yes

Yes

    

40x40

FC1517

  

Yes

Yes

Yes

Yes

42.5x42.5

FC1760

    

Yes

Yes

Yes

45x45

FC1932

        

Yes

47.5x47.5

FC2205

    

 

  

Yes

50x50

FC2397

        

Yes
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Features

Balance Low Power and Performance

Intel’s innovative via configuration technology enables up to 50% lower core power1 or to increase performance in the same power envelope compared to FPGAs.5 Power consumption is further reduced by disconnecting power from unused device resources minimizing static power consumption.

Optimized TCO

Intel® eASIC™ N5X innovations reduce die size for a given logic and IO capacity and lowers unit cost compared to FPGAs.2 Intel eASIC N5X devices significantly reduce NRE4 and can be completed in ½ the development time of a cell-based ASIC on comparable process technology.3

FPGA Replacement & Custom Packages

Intel® eASIC™ package offerings provide options to closely match an FPGA package footprint to simplify migration and reduce transition cost. Further cost reduction can be achieved using small form factor packages minimizing PCB footprint.

Configurable eCells

Intel’s innovative eCell can be configured as logic, arithmetic or flip-flops. This enables the platform to be optimized on a design by design basis for a combination of high performance logic, DSP or highly pipelined designs.

Transceivers & IO

Intel® eASIC™ N5X transceivers are multi-protocol supporting a wide range of connectivity and networking protocols with continuous rates from 250MHz to 32.44 Gbps. Flexible eIO pins support 1.0V to 1.8V IO natively and 2.5V and 3.3V with in package level shifters. DDR4 interfaces are supported at rates up to 3200Mbps with integrated PLL/DLL between every two IO banks.

Intel FPGA Compatible Processor System and Security

Intel’s innovative quad-core Arm® 64-bit hard processor subsystem (HPS) and secure device manager (SDM)6 are ported from Intel® Agilex™ FPGAs meeting security requirements for 5G and military applications throughout the entire product lifecycle from manufacturing, to deployment, to decommissioning of equipment. These systems facilitate compatible migration from FPGAs to Intel® eASIC™ N5X devices.

Design Flow

Intel® eASIC™ eTools offer a framework for design conversion and validation using a combination of internally developed and industry standard third-party tools. This includes synthesis and simulation libraries, IP wrappers to implement eASIC functions, scripts for code validation and running third party synthesis and simulation tools. Intel® Quartus® software Platform Designer is used for the hard processor system configuration. DSP Builder for Intel® FPGAs can also output FPGA and eASIC ready RTL code.

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Applications

Wireless

  • 5G radio & small cells
  • Front haul gateways
  • Microwave backhaul

Artificial Intelligence

  • Inferencing applications

Cloud

  • Acceleration
  • Storage

Video & Broadcast

  • Video encoding/decoding
  • Video processing

Military

  • Radar
  • Secure communications
  • Guidance and control

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Karşılaştır

Ürün ve Performans Bilgileri

1

FPGA'ya kıyasla %50'ye kadar daha düşük güç ile aynı performans – Güçle ilgili tahminler Intel tarafından 28 Temmuz 2020'de tamamlanmıştır. Güç, Intel® Agilex™ FPGA'lar ve N5X cihazlarına yönelik silikon öncesi öngörüler için Intel® Quartus® Prime Tasarım Yazılımı 20.3 kullanılarak tahmin edilmiştir. FPGA cihazı Intel® Agilex™ FPGA AGF014, Intel® eASIC™ N5X cihazı ise N5X047'dir. 500 MHz mantık ve bellek saat hızı kullanılmıştır; her iki cihazda da geçiş oranı mantık için %33, bellek için %50'dir.

2

FPGA'ya kıyasla daha düşük birim maliyeti – Birim maliyeti; eşdeğer mantık, bellek, G/Ç ve Intel® FPGA'lar ile Intel® eASIC™ cihazlarında uygulanan ve aynı paket boyutunu kullanan alıcı-vericiler temel alınarak hesaplanır. Maliyet ve sonuçlar farklılık gösterebilir.

3

ASIC'e kıyasla yarıya inen geliştirme süresi - Geliştirme süresi, benzer işlem düğümündeki hücre tabanlı ASIC ile kıyaslanmıştır.

4

Daha düşük NRE ve mühendislik kaynağı ihtiyacı - NRE ve mühendislik maliyetleri, standart hücre ASIC ile karşılaştırıldığında daha azdır. Bunun nedeni, maskeleme katmanlarında daha az özelleştirme ve yapılandırılmış ASIC'lerde önceden tanımlanmış temel diziler kullanılarak daha az adımda tasarım yapılmasıdır. Maliyet ve sonuçlar farklılık gösterebilir.

5

Performans kullanıma, yapılandırmaya ve diğer faktörlere göre değişir. www.Intel.com/PerformanceIndex sayfasından daha fazla bilgi edinin.

6

Hiçbir ürün veya bileşen mutlak güvenlik sağlayamaz.