Capacity
256 GB
Marketing Status
Discontinued
Launch Date
Q2'19
Use Conditions
PC/Client/Tablet

Performance Specifications

Sequential Bandwidth - 100% Read (up to)
1450 MB/s
Sequential Bandwidth - 100% Write (up to)
650 MB/s
Random Read (8GB Span) (up to)
230000 IOPS (4K Blocks)
Random Write (8GB Span) (up to)
150000 IOPS (4K Blocks)
Power - Active
5.3W
Power - Idle
L1.2 : <12mW

Reliability

Vibration - Operating
2.17 GRMS (5-700 Hz) Max
Vibration - Non-Operating
3.13 GRMS (5-800 Hz) Max
Shock (Operating and Non-Operating)
1000 G / 0.5 ms and 1500 G / 0.5 ms
Operating Temperature Range
0°C to 70°C
Max Operating Temperature
70 °C
Minimum Operating Temperature
0 °C
Endurance Rating (Lifetime Writes)
75TBW
Mean Time Between Failures (MTBF)
1.6 Million Hours
Uncorrectable Bit Error Rate (UBER)
< 1 sector per 10^15 bits read
Warranty Period
5 yrs

Supplemental Information

Product Brief
Additional Information
Description
Introducing the new Intel® Optane™ Memory H10 with Solid State Storage which combines two breakthrough technologies, Low-latency Intel® Optane™ technology and high-density Intel® QLC 3D NAND in a single M.2 2280 form factor.

Package Specifications

Weight
Less than 10 grams
Form Factor
M.2 22 x 80mm
Interface
PCIe 3.0 x4, NVMe

Advanced Technologies

Enhanced Power Loss Data Protection
Yes
Temperature Monitoring and Logging
Yes
End-to-End Data Protection
Yes
Intel® Rapid Start Technology
Yes