Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.
Chen Han Lim demos a solution that collects machine data in a mobile app for manufacturing efficiency.
How real-time factory big data enables smarter decision making and performance with new opportunity.
Video: The benefits of using the Intel® Quark™ SoC X1000 in automated industrial systems. (Oct. 2014)
See how Intel uses knowledge-based qualification to qualify products in unique usage environments.
See how Intel’s Corporate Quality Network (CQN) ensures only the highest-quality products go to market.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.